What is the difference between optical BGA repair bench and non optical equipment?

    What is the difference between optical BGA repair bench and non optical equipment? Many people who don't know much about the repair platform will have this doubt. Let's first understand what is the optical BGA repair platform. To put it bluntly, optical alignment is to use optical modules to take split prism imaging, and then achieve accurate alignment. The non-optical alignment is to use the human eye to align the BGA according to the PCB screen printing line and point. The non-optical alignment only depends on the working experience to control the accuracy. The accuracy of optical BGA repair bench is higher than that of non optical BGA repair bench. We can also make a comparison from the following three levels.

     First, in terms of efficiency, the optical BGA repair bench eliminates the need for manual focusing and is easy to operate. In the actual operation of employees, the Dezheng intelligent optical BGA repair bench only needs to adjust the parameters, and the equipment will disassemble and assemble the BGA chip by itself according to the set program. When using the traditional non optical BGA repair bench, the maintenance staff must pay close attention to the PCB screen printing line and point-to-point alignment, so that a little neglect of alignment maintenance will cause chip damage. In terms of efficiency, the optical BGA repair table is much higher than the non optical BGA repair table.

Second, in terms of the difficulty coefficient of actual operation, the optical BGA repair platform is simple in actual operation, and the whole process is automated in actual operation. There are basically no technical requirements for the maintenance staff. The Dezheng intelligent optical BGA repair platform has the one button practical operation of automatic welding, disassembly, mounting and feeding, which is simple in application and convenient in actual operation; Configure laser red dot positioning. As for the non optical BGA repair bench, the requirements for operators are very high. For the maintenance of larger BGA chips, even skilled maintenance workers sometimes work very hard.

     Third, in terms of safety and throughput, the full-automatic optical BGA repair platform uses the optical module to take split prism imaging, so it does not need manual alignment. At this time, it saves the possibility that the traditional manual alignment operation may damage the BGA chip. The intelligent practical operation equipment for visual alignment, welding and disassembly of BGA originals of different sizes effectively improves the repair rate, productivity and greatly reduces the cost.

     In general, the optical BGA repair platform is much better than the non optical BGA repair platform in terms of production, manufacturing, application, operation efficiency and safety performance.